T e c h n i c a l    i n f o r m a t i o n
 


1. Boards: 1-8 layers;
2. Minimum conductor lines widht – 0.180 mm;
3. Minimum size spaces – 0,180 mm;
4. Tolerance:
    - board dimensions - +/- 0,2 mm;
5. Maximum panel size – 520x400 mm;
6. Minimum dimension of PCB – 0.02 dm2
7. Minimum hole size diameter – 0,35 mm;
8. Minimum pad – 0,8 mm;
9. Board finishes:
    - HAL;
    - IR reflow;
    - Electrolees Nickel Immersion Gold;
    - Gold plating – electroplated gold edge connectors;
    - Carbon paste.
10. Solder resist:
    - photoimagible solder resist;
    - UV solder mask;
    - Two components solder mask;
11. Base material - FR4

 

 © 2004 KASI Ltd. Page last modified on 17.08.2004 design © 2004